Our EMS Capabilities
End-to-End Solutions
From PCB design, prototyping, and assembly to testing, packaging, and logistics – we deliver a complete EMS solution under one roof.
State-of-the-Art Infrastructure
Equipped with advanced SMT, PTH, and automated assembly lines ensuring precision, consistency, and high-volume scalability.
Quality First Approach
ISO-certified processes, Six Sigma methodologies, and strict quality checks at every stage to guarantee zero-defect products.
High-Mix, Low-Volume & High-Volume Flexibility
Whether you need prototypes, small batches, or mass production, we adapt to your requirement seamlessly.
Strong Supply Chain Network
Reliable global sourcing of electronic components with cost optimization and lead-time reduction.
Customizable Manufacturing
Tailor-made production to meet unique client specifications across automotive, industrial, medical, telecom, and consumer electronics sectors.
Testing & Validation Expertise
In-circuit testing, functional testing, environmental & reliability testing for assured performance in real-world conditions.
Rapid Prototyping & NPI (New Product Introduction)
Faster design-to-market cycles with dedicated engineering support for startups and established OEMs.
Cost-Efficiency with Lean Manufacturing
Optimized processes that minimize waste, reduce costs, and improve delivery timelines.
Trusted Partner for Growth
With proven track record, industry expertise, and long-term client relationships, we don't just manufacture – we co-create success.
International Certifications
Technical Capabilities
High-Speed SMT Assembly
Capable of placing 0402, 0201 components & BGA/QFN packages with micron-level accuracy.
Double-Sided PCB Assembly
Expertise in multilayer, double-sided reflow & wave soldering.
Mixed Technology Assembly
Seamless integration of SMT + PTH in one production line.
Fine-Pitch Component Handling
Pitch down to 0.4 mm for BGA & CSPs.
Lead-Free & RoHS Compliant Processes
Environment-friendly soldering with strict compliance.
Automated Optical Inspection (AOI)
100% PCB inspection for shorts, opens, misalignment & solder defects.
X-Ray Inspection Capability
3D X-ray for hidden joints (BGA, QFN, CSP).
Functional & In-Circuit Testing (ICT)
Ensuring performance & reliability before dispatch.
Conformal Coating & Potting
PCB protection for harsh environments (automotive, defence, medical).
Rapid Prototyping & NPI
Quick turnaround for samples and pilot batches.
SMT Line Capabilities & Machine Specs
High-Speed Pick & Place Machines
- Placement Speed: 60,000+ CPH (components per hour)
- Accuracy: ± 25 microns @ 3 sigma
- Component Range: 0201 to 50x50m
High- Automatic Solder Paste Printer
- Printing Accuracy: ± 12.5 microns
- 2D/3D solder paste inspection
Reflow Ovens (10/12 Zone)
- Lead-free capable
- Precise thermal profiling
AOI Systems
- Printing Accuracy: ± 12.5 microns
- 2D/3D solder paste inspection
X-Ray Inspection System
- 2D/3D inspection for BGAs, micro-BGAs & hidden joints
PTH (Through-Hole) Line Capabilities & Machine Specs
Wave Soldering Machine
- Pead-free compatible solder pot
- Adjustable conveyor (0–45° tilt)
- Fluxer + preheater + wave control system
Selective Soldering System
- PIdeal for mixed technology boards
- Precision soldering without affecting SMT joints
Semi-Automatic Insertion & Cutting Machines
- For connectors, coils, relays, power devices